| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact plasma melting device having higher performance than conventional ones, configured to perform processing based on a processing condition varied in accordance with types and situations of processing targets including objects to be processed having high variation.SOLUTION: A plasma melting device includes: an introduction port 14 for introducing a processing object to be molten; a plasma torch 11 positioned at the furnace top; a bottom electrode 12 disposed at a position equivalent to the plasma torch on the furnace bottom; a plasma melting furnace 1 made of a furnace body having exhaust outlets 16, 17; and a mixed-gas supply device 2 mixed with hydrogen and oxygen, connected to the plasma melting furnace 1. |
