| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of preventing device failure or failure in a post-process.SOLUTION: A method for processing a wafer 11 that has a device region and an outer periphery excess region surrounding the device region and on which a chamfering section is formed includes: a step of preparing a surface protection sheet 10 having a base material sheet 12, and an annular paste layer 14 arranged on an outer periphery of the base material sheet 12; a step of positioning the annular paste layer 14 at the outer peripheral excess region of the wafer 11 and adhering the surface protection sheet 10; a step of holding a rear face side of the wafer 11 with a chuck table 16 after performing the surface protection sheet adhesion step; and a chamfering section removing step of cutting and removing a chamfering section 11e by rotating the chuck table 16 while cutting a rotating cutting blade 20 into an outer peripheral edge from a surface side of the wafer 11 by a predetermined depth, and leaving one part of the annular paste layer 14 at least adjacent to the device region. |
