SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device which includes a through electrode provided in a substrate, and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device manufacturing method comprises: forming a through hole 20 which penetrates a semiconductor substrate 10 from a principal surface 13 to a principal surface 11 to expose a conductive layer 16 provided on the principal surface 11 side on the bottom; forming a seed layer 24 extending from the bottom of the through hole to the principal surface 13 through a lateral face of the through hole; forming a conductive layer 26 on the seed layer by first plate processing; forming a resist 28 on the conductive layer 26; forming an opening hole 29 to expose the through hole 20 on the resist by development processing; and forming a conductive layer 30 on the conductive layer 26 exposed on the resist by second plate processing by using the resist in which the opening hole is formed as a mask.