| 摘要 |
PROBLEM TO BE SOLVED: To provide solving means for solving important problems occurring especially in a QFP package that transfer resin molding using a matrix-type lead frame causes increase in a resin use amount, variation in resin filling characteristics and the like resulting from a long resin filling channel.SOLUTION: In a manufacturing method of a resin encapsulated semiconductor circuit device having a QFP package shape, a process of forming an encapsulated body in each QFP unit device region of a matrix-type lead frame 3 by transfer resin molding comprises the following steps of: preparing a pair of molds which connect one pair or two pairs of cavities 52 to respective both sides of multi pots 53 arranged in multiple lines; and filling an encapsulation resin so as to cover the multi pots arranged in multiple lines and the cavities connected to the multi pots with clamping the matrix-type lead frame. |
