| 摘要 |
Disclosed is a radiation-sensitive insulating resin composition which enables to obtain a cured product excellent in electrical insulation, resolution, adhesion and thermal shock resistance in a balanced manner. Specifically disclosed is a radiation-sensitive insulating resin composition which is characterized by containing a compound (A) having a disulfide structure, a resin (B) and a radiation-sensitive compound (D). It is preferable that the radiation-sensitive insulating resin composition further contains, if necessary, a compound (C) having a functional group reactive with an alkali-soluble resin (B1) and a crosslinked fine particles (E) having an average particle diameter of 30-500 nm. |
