| 摘要 |
PURPOSE: A light emitting diode is provided to improve heat discharge performance by using a lead frame as a body of the light emitting diode. CONSTITUTION: A lead frame(100) includes a first lead terminal and a second lead terminal. A connection part is located in a space between the first lead terminal and the second lead terminal. A partition is connected to the connection part and is located around the lead frame. A light emitting chip(300) is mounted on one of the first lead terminal and the second lead terminal. A molding unit(500) seals the light emitting chip. One of the first and second lead terminals includes a second groove. A part of the partition is arranged in the second groove. |
