SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having a POP (Package On Package) structure which enables downsizing, and a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device 10 comprises a semiconductor chip 60 and passive elements 40 which are embedded such that a part of the passive element is embedded and a part of the passive element projects from a first insulation layer 21. The passive element 40 includes an electrode 41 which is electrically connected with a wiring pattern 26 via via wiring 25y formed on an insulation layer 25. The semiconductor device 10 comprises first electrode pads 22 each electrically connected with another semiconductor device 70 via a bonding part 80. A projection amount of the passive element 40 from the first insulation layer 21 is less than a clearance between the first insulation layer 21 and an opposed surface of the other semiconductor device 70.