THERMAL SPREADER HAVING GRADUATED THERMAL EXPANSION PARAMETERS

摘要

PROBLEM TO BE SOLVED: To provide: a method of manufacturing an integrated circuit (IC) device comprising a thermal spreader having graduated thermal expansion parameters; and a system incorporating the IC device.SOLUTION: An apparatus comprises: a die 108; a thermal spreader 112 having a first layer 136 with a first coefficient of thermal expansion (CTE) and a second layer 140 with a second CTE that is greater than the first CTE, where the die is coupled with the first layer 136; and a heat sink 120 coupled with the second layer 140 of the thermal spreader 112.