| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting substrate which allows accurate soldering of electrodes of an electronic component that will be mounted to lands on a printed board and achieves the downsizing.SOLUTION: An electronic component 21 is mounted on a main surface of a substrate 2. In the substrate 2, lands 22, to which electrodes 21a provided at end parts of the electronic component 21 are soldered, are formed on the main surface. Each land 22 has a cutout which exposes the main surface of the substrate 2. The cutout is formed in a size that enables the end part provided with the electrode 21a of the electronic component 21 that will be mounted to pass therethrough. Thus, each end part of the electronic component 21 mounted on the main surface of the substrate 2 is placed not contacting with the land 22 formed on the main surface of the substrate 2 but contacting with the main surface of the substrate 2. |
