发明名称 HOUSING AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
摘要 According to an embodiment of the present disclosure, a substrate processing apparatus including a housing is provided. The housing having an internal atmosphere of a reduced oxygen concentration includes a box structure configured to accommodate a substrate holder which receives a plurality of substrates therein and including a first gap and a second gap. Further, the housing includes an inert gas pipe connected to the box structure, and configured to supply an inert gas to the box structure, a cover member mounted in the box structure, and a buffer space formed between an internal space of the box structure and the cover member.
申请公布号 US2013319332(A1) 申请公布日期 2013.12.05
申请号 US201313903331 申请日期 2013.05.28
申请人 TOKYO ELECTRON LIMITED 发明人 GOKON KIYOHIKO
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
地址