| 摘要 |
PURPOSE: A load port is provided to minimize a setting process by arranging horizontal balance of the load port while mounting the load port by closely attaching to a combining surface of a semiconductor transfer device. CONSTITUTION: A base plate is connected to a semiconductor transfer device. A supporting part(120) supports a wafer cassette by being projected from one side of the base plate. An alignment part(130) is attached on the rear surface of a wafer plate. The alignment part comprises a left/right alignment member(132) and a front/rear alignment member(134). A central part is projected to a lower part in the left/right alignment member. The front/rear alignment member has a width which is gradually narrowed toward an outer lower part based on the rear surface of the front/rear alignment member. |
