LAMINATE FOR CIRCUIT BOARD, METALLIC BASE CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THEM

摘要

PROBLEM TO BE SOLVED: To simultaneously attain high withstand voltage and high peel strength.SOLUTION: A method for manufacturing a laminate for a circuit board comprises the steps of: transferring an insulation layer 3' which is formed on a support 5, contains electrical insulating resin 3a' and an electrical insulating inorganic filler 3b and arbitrarily contains solvent from the support 5 to metal foil; and sticking the metal foil and a metal substrate together by sandwiching the insulation layer 3' between them.