ORGANIC SEMICONDUCTOR ELEMENT ENCAPSULATION BODY

摘要

PROBLEM TO BE SOLVED: To provide an organic semiconductor element encapsulation body which has excellent durability.SOLUTION: An organic semiconductor element encapsulation body comprises: an organic semiconductor element 12 composed of a laminate including a pair of electrode layers 12a and 12c, and an organic semiconductor layer 12b arranged between the pair of electrode layers 12a and 12c; a transparent substrate 14; and an encapsulation film material 16 for encapsulating the organic semiconductor element 12 with the transparent substrate 14. The encapsulation film material 16 and the transparent substrate 14 encapsulate the organic semiconductor element 12 sandwiching it from both sides and thermally compress it on the peripheral part with a thermally adhesive sealing material 18. The thermally adhesive sealing material 18 leaks inside more inward than a thermally compressed peripheral part 16a of the encapsulation film material 16, and a thickness of the thermally adhesive sealing material 18 at a part where it leaks is not smaller than a thickness of the thermally compressed peripheral part and not greater than a thickness of a part where the organic semiconductor element 12 is arranged.