发明名称 |
METHODS OF SEPARATING SOLID STATE TRANSDUCERS FROM SUBSTRATES AND ASSOCIATED DEVICES AND SYSTEMS |
摘要 |
Wafer-level processing of wafer assemblies with transducers is described herein. A method in accordance with some embodiments includes forming a solid state transducer device by forming one or more trenches to define solid state radiation transducers. An etching media is delivered in to the trenches to release the transducers from a growth substrate used to fabricate the transducers. A pad can hold the radiation transducers and promote distribution of the etching media through the trenches to underetch and release the transducers. |
申请公布号 |
US2013320386(A1) |
申请公布日期 |
2013.12.05 |
申请号 |
US201213482856 |
申请日期 |
2012.05.29 |
申请人 |
SCHUBERT MARTIN F.;ZHANG MING;XU LIFANG;MICRON TECHNOLOGY, INC. |
发明人 |
SCHUBERT MARTIN F.;ZHANG MING;XU LIFANG |
分类号 |
H01L33/62;H01L33/08 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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