SOLDER PASTE AND METAL BONDED CERAMIC SUBSTRATES

摘要

The present invention relates to solder paste for bonding a metal plate to ceramic substrate, wherein the solder paste includes 1-40 wt% Cu, 60-99 wt% of Ag, 0.5-4.5 wt% of active metal against the total 100 wt% of Cu and Ag, metal including 0.01-5.0 wt% of NiO, and organic vihicles. The present invention relates solder paste and metal bonded ceramic substrates which improves the degradation of yield strength.