| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame with a resin which prevents an outer resin part from being dropped from a space between a die pad and a lead part, a lead frame, and a semiconductor device.SOLUTION: A lead frame 30 with a resin includes: a die pad 11 on which an LED element 21 is placed; and a lead part 12 which is provided around the die pad 11 through a space 13. The die pad 11 and the lead part 12 respectively have facing surfaces 14, 15 facing each other through the space 13. The facing surface 14 of the die pad 11 and the facing surface 15 of the lead part 12 are formed into irregular shapes. Further, an outer resin part 23 filling the space 13 between the die pad 11 and the lead part 12 is provided. |
