发明名称 SHIELDING FOR INTEGRATED CAPACITORS
摘要 A capacitor (220) in an integrated circuit ("IC") includes a core capacitor portion (201 ) having first conductive elements (T1, T2, T3, T4) electrically connected to and forming a part of a first node of the capacitor formed in a first layer (M3) and second conductive elements (B1, B2, B3) electrically connected to and forming a part of a second node of the capacitor formed in the first layer. The first and second conductive elements alternate in the first conductive layer. Third conductive elements (T) electrically connected to and forming a part of the first node are formed in a second layer (M2) adjacent to the first layer (M3). The capacitor also includes a shield capacitor portion (203) having fourth conductive elements (238, B, B' ) formed in at least first, second, third, and fourth layers (M3, M2, M4, Poly). The shield capacitor portion is electrically connected to and forms a part of the second node of the capacitor and surrounds the first and third conductive elements.
申请公布号 KR101337075(B1) 申请公布日期 2013.12.05
申请号 KR20117013887 申请日期 2009.10.23
申请人 发明人
分类号 H01L21/02;H01L23/60;H01L27/02;H01L29/00 主分类号 H01L21/02
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