发明名称 |
FAST SUBSTRATE SUPPORT TEMPERATURE CONTROL |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for controlling the temperature of a substrate support.SOLUTION: In some embodiments, an apparatus for controlling the temperature of a substrate support 116 may include a first heat transfer loop 202 and a second heat transfer loop 210. The first heat transfer loop may have a first bath 204 with a first heat transfer fluid at a first temperature. The second heat transfer loop may have a second bath 212 with a second heat transfer fluid at a second temperature. The first and second temperatures may be the same or different. First and second flow controllers 206 and 214 may be provided for respectively providing the first and second heat transfer fluids to the substrate support. One or more return lines may couple one or more outlets of the substrate support to the first and second baths for returning the first and second heat transfer fluids to the first and second baths. |
申请公布号 |
JP2013243377(A) |
申请公布日期 |
2013.12.05 |
申请号 |
JP20130140377 |
申请日期 |
2013.07.04 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
RICHARD FOVELL;PAUL BRILLHART;YI SANG IN;ANISUL H KHAN;JIVKO DINEV;SHANE NEVIL |
分类号 |
H01L21/3065;C23C16/46;H01L21/205;H01L21/683 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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