发明名称 SPUTTERING APPARATUS AND SPUTTERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of attaining film formation with improved quality and productivity by reducing contamination by a bonding material.SOLUTION: In a sputtering apparatus for performing film formation to a plurality of solar cell substrates 40a, 40b, 40c and the like which are placed on a tray 30 by use of a rotary cylindrical target 20 having a plurality of target pieces 20a-20e, the positions of gaps 50a-50d among the target pieces match with portions 30s of the tray 30 in which the solar cell substrates 40a, 40b, 40c and the like are not placed.
申请公布号 JP2013241633(A) 申请公布日期 2013.12.05
申请号 JP20120113905 申请日期 2012.05.18
申请人 PANASONIC CORP 发明人 HAYATA HIROSHI
分类号 C23C14/34 主分类号 C23C14/34
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