发明名称 |
Chipgehäuse und Verfahren zum Bilden desselben |
摘要 |
Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip. |
申请公布号 |
DE102013103860(A8) |
申请公布日期 |
2013.12.05 |
申请号 |
DE201310103860 |
申请日期 |
2013.04.17 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
LEE, SWEE KAH;MENGEL, MANFRED;SCHMID, STEFAN;TORWESTEN, HOLGER;GOH, SOON LOCK |
分类号 |
H01L21/56;H01L21/58;H01L21/60;H01L23/28;H01L23/482;H01L23/488 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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