发明名称 CONTACT STRUCTURE
摘要 PROBLEM TO BE SOLVED: To improve reliability of contacts of an anisotropic conductive film for connecting lead-out terminals with FPC (Flexible Print Circuit) in a liquid crystal panel.SOLUTION: In a contact structure, connection wiring 183 on an active matrix substrate is electrically connected with an FPC 191 at a terminal part 182 by an anisotropic conductive film 195. The connection wiring 183 is manufactured in the same process with that of source/drain wiring of a TFT on the active matrix substrate and composed of layered films of a metal film 140 and a transparent conductive film 141. At a connection part with the anisotropic conductive film 195, lateral faces of the connection wiring 183 are covered with a protection film 173 made of an insulating material. Accordingly, because lateral faces of the metal film is covered with the protection film 173, the metal film is surrounded by and in proximity to the transparent conductive film 141, an insulation film 109 of the ground and the protection film 173 and does not air out at this part.
申请公布号 JP2013243372(A) 申请公布日期 2013.12.05
申请号 JP20130132948 申请日期 2013.06.25
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 G02F1/1339;H05K3/28;G02F1/1343;G02F1/1345;G02F1/136;G02F1/1368;G09F9/00;G09F9/30;H01L21/3205;H01L21/60;H01L23/48;H01L23/52;H01L29/786;H01R11/01;H05K1/11;H05K1/14 主分类号 G02F1/1339
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