PEELING DEVICE AND PEELING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a peeling device and a peeling method capable of avoiding the risk that bumps formed on a substrate are damaged by a support body in a state where the support body is peeled off from a substrate.SOLUTION: A peeling device 20 includes: a stage 23 on which a laminate 1 is placed while turning down the wafer 3 side; and a chamber 21 which supplies a solvent dissolving an adhesive layer to the laminate 1 in a state in contact with the stage 23. The stage 23 is formed so that a placement part 23a placing the laminate therein is recessed in a curved surface shape from the surface of the stage 23.