A MEMS microphone module includes a substrate and a conducting lid covered on the substrate to define a chamber therebetween for accommodation of a MEMS chip and an ASIC chip. A ground layer of the substrate is electrically coupled to a protrusion of the conductive lid to form an EMI shielding structure. By this way, an EMI shielding effect can be applied by the EMI shielding structure to the MEMS chip and the ASIC chip.
