Device for wet treatment of substrates e.g. silicon wafer, has support elements on which substrate support is pointed up and down, such that substrates are in parallel state at constant, limiting distance force

摘要

The device has several columns (3) that are fitted together with an upper cover plate (2.1) and a lower cover plate (2.2), to support the substrates (5). The point-terminating substrate supports (4.0) are pointed up and down in arm-shaped support elements (4) at the free end, such that the substrates are parallel to each other at a constant, limiting distance force. An independent claim is included for support and spacing elements.