发明名称 ELECTRONIC CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit device which efficiently radiates heat generated by an electronic component involving heat generation to the exterior of the device.SOLUTION: An electronic circuit device includes: a multilayer circuit board 10 including a surface layer 11, an inner layer 12 positioned at the rear side of the surface layer 11, and a rear layer 13 positioned at the rear side of the inner layer 12, the multilayer circuit board 10 where an electrode part 11a is formed on the surface layer 11; an electronic component 11b disposed at the electrode part 11a and generating heat; and a housing 20 housing the electronic component 11b. The multilayer circuit board 10 includes: a first ground pattern 12b provided on the inner layer 12; and second ground patterns 31, 32 respectively provided at peripheral parts of the surface layer 11 and the rear layer 13 so as to contact with the housing 20. The first ground pattern 12b establishes electrical continuity with the electrode part 11a through a through hole 14, and the second ground patterns 31, 32 establish electrical continuity with the first ground pattern 12b through another through hole 15 different from the through hole 14.
申请公布号 JP2013243228(A) 申请公布日期 2013.12.05
申请号 JP20120115157 申请日期 2012.05.21
申请人 NIPPON SEIKI CO LTD 发明人 TAKANO TETSUHIRO
分类号 H05K1/02;H01L23/02;H01L23/06;H01L23/12 主分类号 H05K1/02
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