| 摘要 |
According to one exemplary implementation, a method includes lithographically forming a plurality of reticle images on a semiconductor wafer. The method further includes singulating the semiconductor wafer into an interposer die such that the interposer die includes at least a portion of a first reticle image and at least a portion of a second reticle image from the plurality of reticle images. The first reticle image and the second reticle image can be produced from a single reticle. The method can further include electrically connecting a first active die to a second active die through the interposer die. The method can also include electrically connecting the first active die to a package substrate through the interposer die. |
