发明名称 |
MULTILAYER ELECTRONIC STRUCTURES WITH INTEGRAL VIAS EXTENDING IN IN-PLANE DIRECTION |
摘要 |
A multilayer electronic support structure comprising at least one pair of adjacent feature layers extending in an X-Y plane that are separated by a via layer; said via layer comprising a dielectric material that is sandwiched between the two adjacent feature layers and at least one one non-cylindrical via post that couples said pair of adjacent feature layers through the dielectric material in a Z direction perpendicular to the X-Y plane; wherein said at least one non-cylindrical via post is characterized by having a long dimension in the X-Y plane that is at least 3 times as long as a short dimension in the X-Y plane. |
申请公布号 |
US2013319736(A1) |
申请公布日期 |
2013.12.05 |
申请号 |
US201213482045 |
申请日期 |
2012.05.29 |
申请人 |
HURWITZ DROR |
发明人 |
HURWITZ DROR |
分类号 |
H05K1/09;B32B37/02;H05K1/11;H05K13/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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