| 摘要 |
The invention relates to an electronic module 100), in particular for an electronic control unit, having a substrate (200) having a first (220) side (210) and a second side (220) facing away from the first side, wherein the substrate (200) has a first surface (211) on the first side (210) and a second surface (212) on the second side (220), wherein electrical and/or electronic components (300) are arranged on the first side (210) and/or the second side (220) on the substrate (200), wherein at least one electrical and/or electronic component (310) generates heat in operation. In order to simply, cost-effectively and reliably achieve cooling of the electrical and/or electronic components (310) generating heat, according to the invention, there is a first mold compound (410) on the first side (210) of the substrate (200) made of a first material and a second mold compound (420) on the second side (220) of the substrate (200) made of a second material, different from the first material, such that a continuous surface area of at least 80% of the second surface (212) of the substrate (200) is directly or indirectly covered by the second mold compound (420). According to the invention, the second material shall have a higher thermal conductivity than the first material. The invention further relates to a method for producing an electronic module (100) and an electronic control unit (800) having an electronic module (100). |
