发明名称 COATING APPLICATOR, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To inhibit the occurence of problems due to adherence of a coating liquid to the interior of a coating applicator in the coating applicator which rotates a substrate thereby spreading the coating liquid to a substrate surface.SOLUTION: A coating applicator 10 includes: a cup 11 enclosing a substrate 1; a nozzle 12 discharging a coating liquid to the substrate 1; a rotation part 18 rotating the substrate 1; a discharge passage 14 discharging the coating liquid from the cup 11; and device cleaning parts 16, 17 supplying a cleaning liquid to at least one of an inner wall of the cup 1 and the discharge passage 14.
申请公布号 JP2013243317(A) 申请公布日期 2013.12.05
申请号 JP20120117002 申请日期 2012.05.22
申请人 TOKYO OHKA KOGYO CO LTD 发明人 INAO YOSHIHIRO;KATSURAGAWA JUNICHI;TSUSHIMA SHUGO
分类号 H01L21/027;B05C11/08;B05D1/40 主分类号 H01L21/027
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