| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer protective member which allows for excellent wafer thinning and does not damage and contaminate a device on a surface side of a wafer even if a bump or the like is not formed but a surface of the device is formed flat in the wafer.SOLUTION: A wafer protective member 1 protects a surface WS of a wafer W in which a device is formed. The wafer protective member 1 comprises: an outer periphery sticking part 3 stuck only to a chamfer part M of the wafer W and an outer periphery region GR in which a device is not formed; and a device protection part 4 which is surrounded by the outer periphery sticking part 3, abuts on a device region DR, and protects the device in a non-sticking state, and the like. A surface 6 abutting on the wafer W of the outer periphery sticking part 3 is formed of an inner peripheral surface 6a matching a cross-sectional shape of the chamber part M and a ring shape 6b corresponding to the outer periphery region GR. |
