发明名称 LED PACKAGE MANUFACTURING SYSTEM AND RESIN COATING METHOD FOR USE IN LED PACKAGE MANUFACTURING SYSTEM
摘要 In resin coating, carrying a light-passing member test-coated with a resin on a light-passing member carrying unit; making a light source placed above the light-passing member carrying unit emit excitation light exciting the fluorescent substance; measuring light emission characteristics of the light by irradiating the excitation light emitted from the light source unit from above to the resin coated onto the light-passing member and receiving the light that the resin emits from below the light-passing member by a light emission characteristic measurement unit; obtaining a deviation between a measurement result of the light emission characteristic measurement unit and a prescribed light emission characteristic; and deriving the appropriate resin coating quantity of the resin to be coated onto the LED element as what is used for practical production based on the deviation.
申请公布号 US2013323862(A1) 申请公布日期 2013.12.05
申请号 US201214000346 申请日期 2012.05.30
申请人 NONOMURA MASARU;PANASONIC CORPORATION 发明人 NONOMURA MASARU
分类号 H01L21/66 主分类号 H01L21/66
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