发明名称 COVER HAVING METALLIC GRID STRUCTURE AND METHOD FOR MANUFACTURING THE COVER
摘要 Provided are a cover having a metallic grid structure and a method for manufacturing the cover. The cover includes a pattern portion formed of a metallic material, in which a plurality of patterns are independently disposed spaced apart from each other and an injection portion disposed between pattern portions to connect the pattern portions, the injection portion being formed of a non-metallic material. The method includes forming a pre-pattern portion including patterns in a regular or irregular form and a bridge connecting the patterns on a metallic plate, forming the injection portion on the pre-pattern portion by insert-injection or thermo-compression press, and removing the bridge.
申请公布号 US2013323579(A1) 申请公布日期 2013.12.05
申请号 US201313907615 申请日期 2013.05.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG YONG-WOOK;CHO SUNG-HO;MOON HEE-CHEUL;BAEK SEUNG-CHANG;PARK CHAN-SEOB
分类号 H01M2/04 主分类号 H01M2/04
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