| 摘要 |
An imaging device (10) is provided with an imaging chip (30), a transparent glass cover (20) that is larger than the imaging chip (30) in a planar view, a transparent adhesive layer (41) that bonds the glass cover (20) to a first principal surface (30SA) of the imaging chip (30), and a sealing member (42) that comprises an insulating material, covers the sides of the imaging chip (30) and the sides of the adhesive layer (41), and is the same size as the glass cover (20) in a planar view. On the first principal surface (30SA), the imaging chip (30) has a light-receiving part (31) and an electrode pad (32) formed around said light-receiving part (31), and on a second principal surface (30SB), the imaging chip (30) has an external-connection electrode (34) connected to the electrode pad (32) via through-wiring (33). |
