| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a system, capable of interconnecting between memory devices.SOLUTION: A device and a system comprise: a substrate; an interface chip arranged on the substrate; a first memory die having a plurality of memory arrays arranged on the interface chip and connected to a plurality of through wafer interconnects (TWI); and a second memory die having a plurality of memory arrays arranged on the first memory die and including a plurality of vias. The plurality of vias is formed so that the plurality of TWI(s) penetrate the second memory die. The second memory die may be connected with a plurality of second TWI(s). In such a way, the interface chip may be used in order to communicate the first memory die and the second memory die using a plurality of first TWI(s) and the plurality of second TWI(s). |
