| 摘要 |
PROBLEM TO BE SOLVED: To prevent relative positional displacement between a wafer and a support plate superposed on each other by a superposing apparatus, when the wafer and the support plate are conveyed to a sticking apparatus.SOLUTION: A superposing apparatus according to the present invention includes a temporary fixing part 24 which presses a partial region of a support 41 superposed on a substrate 42 toward the substrate 42 and heats the partial region, thereby temporarily fixes the support 41 to the substrate 42. |
