发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8). |
申请公布号 |
US2013320571(A1) |
申请公布日期 |
2013.12.05 |
申请号 |
US201313960596 |
申请日期 |
2013.08.06 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
KADO YOSHIYUKI;NAITO TAKAHIRO;SATO TOSHIHIKO;IKEGAMI HIKARU;KIKUCHI TAKAFUMI |
分类号 |
H01L23/00;H01L23/31;H01L23/50;H01L23/538;H01L25/065 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|