| 摘要 |
Various apparatuses, methods, and systems are provided for cooling electronic components. For example, an apparatus includes an electronics enclosure having multiple ribs (110, 226, 326, 426) configured to separate electronic components. The apparatus also includes at least one fluid transport structure (208, 308, 408) encased within the electronics enclosure (100, 218, 224). Each fluid transport structure includes multiple pipes (210, 310, 410) and multiple flow channels (212, 412, 502, 504, 506, 510-516, 518, 520, 606, 608). The flow channels are located within the ribs of the electronics enclosure, and the pipes are configured to transport cooling fluid to and from the flow channels. |
