| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board for gene analysis that is suitable for use in gene analysis using nanopores.SOLUTION: A negative-type photosensitive resin layer 3P having a lower-layer region 3b up to a height exceeding a detection electrode 9 from the upper surface of a first insulating layer 2 and an upper-layer region 3b up to a surface from the top of the lower-layer region is coated over the first insulating layer 2 and the detection electrode 9, and exposure is performed in such a way that a first unexposed portion N1 having a first diameter and a second unexposed portion N2 having a second diameter smaller than the first diameter remain respectively on the detection electrode 9, while the peripheries of the first and second unexposed portions N1, N2 are exposed. Next, the first and second unexposed portions N1, N2 are developed and removed and the lower-layer region 3a and upper-layer region 3b exposed are hardened, whereby a detection recess C whose inside diameter is large in the lower-layer region 3a and small in the upper-layer region 3b is formed on the detection electrode 9. |
