发明名称 |
HEAT-DISSIPATING APPARATUS |
摘要 |
The present disclosure provides a heat-dissipating apparatus for printed circuit board. The heat-dissipating apparatus adopts a ceramic device arranged between the printed circuit board and ground. Therefore, the apparatus can achieve the purpose of heat dissipation and save space of the printed circuit board and save cost of using a fan and cooling fins. |
申请公布号 |
US2013322022(A1) |
申请公布日期 |
2013.12.05 |
申请号 |
US201213488412 |
申请日期 |
2012.06.04 |
申请人 |
WU TUNG-FENG;SUNG TZE-YUN |
发明人 |
WU TUNG-FENG;SUNG TZE-YUN |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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