发明名称 |
INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE, RELATED METHOD AND DESIGN STRUCTURE |
摘要 |
An integrated circuit (IC), design structure, and a method of making the same. In one embodiment, the IC includes: a substrate; a dielectric layer disposed on the substrate; a set of wire components disposed on the dielectric layer, the set of wire components including a first wire component disposed proximate a second wire component; a bond pad disposed on the first wire component, the bond pad including an exposed portion; a passivation layer disposed on the dielectric layer about a portion of the bond pad and the set of wire components, the passivation layer defining a wire structure via connected to the second wire component; and a wire structure disposed on the passivation layer proximate the bond pad and connected to the second wire component through the wire structure via. |
申请公布号 |
US2013320536(A1) |
申请公布日期 |
2013.12.05 |
申请号 |
US201213482864 |
申请日期 |
2012.05.29 |
申请人 |
COONEY, III EDWARD C.;GAMBINO JEFFREY P.;HE ZHONG-XIANG;LEIDY ROBERT K.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COONEY, III EDWARD C.;GAMBINO JEFFREY P.;HE ZHONG-XIANG;LEIDY ROBERT K. |
分类号 |
H01L23/52;G06F17/50;H01L21/768 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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