发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor light emitting device package includes a base unit including a main body having electrical insulation properties and at least one pair of first and second through electrodes formed in the main body in a thickness direction thereof and formed of a semiconductor material, and a light emitting structure disposed on the base unit and including first and second conductivity type semiconductor layers and an active layer interposed there between. The manufacturing process thereof may be simplified, whereby a reduction in manufacturing costs and time may be achieved. |
申请公布号 |
US2013320293(A1) |
申请公布日期 |
2013.12.05 |
申请号 |
US201313908151 |
申请日期 |
2013.06.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
SEO JONG WAN;KIM HYUNG KUN |
分类号 |
H01L33/36;H01L33/50 |
主分类号 |
H01L33/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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