MAGNETRON SPUTTERING DEVICE, MAGNETRON SPUTTERING METHOD, AND STORAGE MEDIUM

摘要

The present invention provides a technique that allows a film to be highly uniformly formed within a substrate surface by means of magnetron sputtering. This magnetron sputtering device is equipped with: a target that is placed so as to face a substrate mounted on a mount part inside a vacuum container; and a magnet array that is provided behind the target and comprises an array of magnets. The device is configured with: a gas supply part for supplying a plasma-generating gas into the vacuum container; a rotating mechanism for rotating the mount part; a power supply part for applying a voltage to the target; a moving mechanism for moving the magnet array between a first region and a second region that is located closer to the outer edge side of the target than the first region; and a control unit that outputs a control signal such that the average moving speed of the magnet array differs between the first region and the second region.