SEMICONDUCTOR DEVICE

摘要

A semiconductor device is provided. The semiconductor device includes a first semiconductor package which includes a first substrate which includes a first region to which a data signal is provided and a second region to which a control/address signal is provided, a second semiconductor package which is mounted on the first semiconductor package, and a connection structure which electrically connects the first and second semiconductor packages. The connection structure includes first connection patterns which are arranged in the first region and provide the data signal and second connection patterns which are arranged in the second region and provide the control/address signal. The number of the second connection patterns is smaller than the number of the first connection patterns.