| 摘要 |
A high-frequency module is integrally formed from at least some of circuit components forming a first wireless system using a first frequency band and at least some of circuit components forming a second wireless system using a second frequency band. The high-frequency module includes a multilayer substrate (3) formed from a plurality of stacked dielectric layers, a first terminal group (31) disposed on a first surface of the multilayer substrate (3), where a plurality of terminals (21 and 25a-25d) are arranged along a first side (15) of four sides forming the first surface, and a second terminal group (32) disposed on the first surface, where a plurality of terminals (22, 25d, 26a, and 26b) are arranged along a second side (16) different from the first side (15). The first terminal group (31) includes a first antenna terminal (21) of the first wireless system whereas the second terminal group (32) includes a second antenna terminal (22) of the second wireless system. |
