SENSOR CHIP COMPRISING A SPACER FOR PROTECTING THE SENSOR ELEMENT

摘要

In a method for manufacturing a sensor chip a spacer (3) is arranged at the front side (11) of a substrate (1) at which front side (11) a sensing element (2) is arranged, too. Holes (14) are etched for building vias (15) extending through the substrate (1) between the front side (11) of the substrate (1) and its back side (12). After etching, the holes (14) are filled with conductive material to complete the vias (15). The spacer (3) provides protection to the sensing element (2) and the sensing chip throughout the manufacturing process.