| 发明名称 |
Photosensitive resin composition and manufacturing method of semiconductor device using the same |
| 摘要 |
<p>A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor device using the composition.</p> |
| 申请公布号 |
EP1811340(A3) |
申请公布日期 |
2013.12.04 |
| 申请号 |
EP20070001388 |
申请日期 |
2007.01.23 |
| 申请人 |
FUJIFILM CORPORATION |
发明人 |
SATO, KENICHIRO;YAMANAKA, TSUKASA |
| 分类号 |
G03F7/022;G03F7/023;G03F7/075 |
主分类号 |
G03F7/022 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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