发明名称 DEPOSITION COATING METHOD OF ELECTRONIC DEVICE CASE
摘要 The present invention relates to a method for metallizing injection molded products. The purpose of the present invention is to provide the method for metallizing the exterior of the injection molded products, capable of performing even metallizing by using a disposable thin tungsten coil mounted inside a chamber and uniformly vaporizing metal in which a melting point is high. Accordingly, the present invention is capable of remarkably improving attachment reliability by metallizing metal in which the melting point is greater than 1100°C and preventing electromagnetic waves from interfering when it is used for object surface injection-molded with magnesium or aluminum. [Reference numerals] (AA) Manufacture a tungsten coil;(BB) Mount the tungsten coil in a heating rod;(CC) Vacuum treatment;(DD) Deposition treatment
申请公布号 KR20130131605(A) 申请公布日期 2013.12.04
申请号 KR20120055277 申请日期 2012.05.24
申请人 FINECOATINA CO., LTD. 发明人 JEE, JU HWAN
分类号 C23C14/24;C23C14/14 主分类号 C23C14/24
代理机构 代理人
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