| 摘要 |
<p>A mold structure according to the present invention is formed from a molding resin including at least a thermosetting resin, an electrically insulating inorganic filler containing at least a metal hydrate, and a dispersant. Thus, it is possible to improve the dispersibility of the inorganic filler in the molding resin, and increase the filling property and fluidity of the inorganic filler. As a result, the molding resin which has a high thermal conductivity and excellent moldability can achieve a mold structure with high radiation performance.</p> |
