| 摘要 |
The present invention relates to a flux or solder transferring device for mounting parts and a method for mounting parts using the same and, more specifically, provided are a flux or solder transferring device for mounting parts and a method for mounting parts using the same comprising: a body part; and a protruding part for being arranged in one surface of the body part and transferring flux or solder on a substrate in which parts are mounted; wherein the body part is combined to a movement body moving between an acceptor of the flux or solder and a substrate and is operated to transfer the flux or solder from the acceptor of the flux or solder, and the protruding part, which is formed in a position matched with a part mounted position, transfers the flux or solder in the part mounted position. According to the above present invention, a transferring process is improved to transfer flux or solder in parts by not directly transferring the flux or solder in the parts but using an additional flux and solder transferring device, thereby reducing a loss rate of the parts and improving the speed of a part production process and productivity. |
