发明名称
摘要 <p>Provided is a technique for a wafer inspection conducted by simple operation, which is useful even when the inspection covers a variety of items and the inspection items are changed frequently with time like in a start-up period of a semi-conductor process. According to the technique, inspection images are collected, and then a template is prepared from the inspection images. A plurality of regions are defined on the template, and inspection methods and output indexes are registered in correspondence with the respective regions. In the inspection, by reference to the template images corresponding to the derived inspection images, the inspection is conducted based on the inspection information registered therein and the quantitative output levels are calculated.</p>
申请公布号 JP5357725(B2) 申请公布日期 2013.12.04
申请号 JP20090275647 申请日期 2009.12.03
申请人 发明人
分类号 H01L21/66;G01N23/225 主分类号 H01L21/66
代理机构 代理人
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